Your right solution
for high-purity metal supplies
for high-purity metal supplies
Ultrafine copper powder (UFP)
high purity
high purity
✓ Purity: 99.999% - 99.9999%
✓ Dispersion: 5–10 µm | 15–30 µm | 30–50 µm | 150–200 µm
✓ Particle shape: spherical, oval, dendritic (according to specifications)
✓ Production method: evaporation and condensation of copper vapor in a vacuum or electrolysis
✓ Dispersion: 5–10 µm | 15–30 µm | 30–50 µm | 150–200 µm
✓ Particle shape: spherical, oval, dendritic (according to specifications)
✓ Production method: evaporation and condensation of copper vapor in a vacuum or electrolysis
Ultrafine copper powder (UFP)
high purity
high purity
✓ Purity: 99.999% - 99.9999%
✓ Dispersion: 5–10 µm | 15–30 µm | 30–50 µm | 150–200 µm
✓ Particle shape: spherical, oval, dendritic (according to specifications)
✓ Production method: evaporation and condensation of copper vapor in a vacuum or electrolysis
✓ Dispersion: 5–10 µm | 15–30 µm | 30–50 µm | 150–200 µm
✓ Particle shape: spherical, oval, dendritic (according to specifications)
✓ Production method: evaporation and condensation of copper vapor in a vacuum or electrolysis
Ultrafine Copper Powder
5 - 10 µm
5 - 10 µm
Supplied in 2 kg PET jars; 0.25 kg glass ampoules; in 85 kg containers
Ultrafine Copper Powder
15 - 30 µm
15 - 30 µm
Supplied in 2 kg PET jars;
in 85 kg containers
in 85 kg containers
Ultrafine Copper Powder
30 - 50 µm
30 - 50 µm
Supplied in 2 kg PET jars;
in 85 kg containers
in 85 kg containers
We offer copper powder: ultrafine (UFP) - a high-tech material with a particle size of 5 to 50 microns and a purity of up to 99.9999%.
Production method: refining of copper blanks using multiple electrolysis and diffusion cathodes, resulting in copper quality increased to 99.999–99.9999% Cu;
- for particle sizes of 5–10 µm: production of ultrafine copper powder in an exclusive vacuum unit using plasma heating of blanks to a vapor state and subsequent evaporation and condensation of copper vapor in a vacuum;
- for particle sizes greater than 15 µm: reduction from solutions/electrolysis followed by sieving of the powder.
Key characteristics:
• Specific surface area: 0.1 to 2.5 m²/g (depending on fraction)
• Bulk density: 1.8–3.2 g/cm³
• Oxygen content: ≤ 0.05%
• Impurities: total ≤ 0.003% (for 6N purity)
The material is intended for use in industries where the following are critical:
→ High electrical and thermal conductivity
→ Sinterability and reactivity
→ Stable chemical composition
- for particle sizes of 5–10 µm: production of ultrafine copper powder in an exclusive vacuum unit using plasma heating of blanks to a vapor state and subsequent evaporation and condensation of copper vapor in a vacuum;
- for particle sizes greater than 15 µm: reduction from solutions/electrolysis followed by sieving of the powder.
Key characteristics:
• Specific surface area: 0.1 to 2.5 m²/g (depending on fraction)
• Bulk density: 1.8–3.2 g/cm³
• Oxygen content: ≤ 0.05%
• Impurities: total ≤ 0.003% (for 6N purity)
The material is intended for use in industries where the following are critical:
→ High electrical and thermal conductivity
→ Sinterability and reactivity
→ Stable chemical composition
We offer copper powder: ultrafine (UFP) - a high-tech material with a particle size of 5 to 50 microns and a purity of up to 99.9999%.
Production method: refining of copper blanks using multiple electrolysis and diffusion cathodes, resulting in copper quality increased to 99.999–99.9999% Cu;
- for particle sizes of 5–10 µm: production of ultrafine copper powder in an exclusive vacuum unit using plasma heating of blanks to a vapor state and subsequent evaporation and condensation of copper vapor in a vacuum;
- for particle sizes greater than 15 µm: reduction from solutions/electrolysis followed by sieving of the powder.
Key characteristics:
• Specific surface area: 0.1 to 2.5 m²/g (depending on fraction)
• Bulk density: 1.8–3.2 g/cm³
• Oxygen content: ≤ 0.05%
• Impurities: total ≤ 0.003% (for 6N purity)
The material is intended for use in industries where the following are critical:
→ High electrical and thermal conductivity
→ Sinterability and reactivity
→ Stable chemical composition
- for particle sizes of 5–10 µm: production of ultrafine copper powder in an exclusive vacuum unit using plasma heating of blanks to a vapor state and subsequent evaporation and condensation of copper vapor in a vacuum;
- for particle sizes greater than 15 µm: reduction from solutions/electrolysis followed by sieving of the powder.
Key characteristics:
• Specific surface area: 0.1 to 2.5 m²/g (depending on fraction)
• Bulk density: 1.8–3.2 g/cm³
• Oxygen content: ≤ 0.05%
• Impurities: total ≤ 0.003% (for 6N purity)
The material is intended for use in industries where the following are critical:
→ High electrical and thermal conductivity
→ Sinterability and reactivity
→ Stable chemical composition
Precision classification
Control at every stage
Product protection
• Automated real-time monitoring of synthesis parameters
• Consistent reproduction of characteristics from batch to batch
• Elimination of contamination due to closed process cycles
• Consistent reproduction of characteristics from batch to batch
• Elimination of contamination due to closed process cycles
• Latest-generation air separators for precise particle size distribution
• Particle size distribution control using laser diffraction or scanning electron microscopy
• Possibility of obtaining narrow particle sizes with a tolerance of ±1–2 µm
• Particle size distribution control using laser diffraction or scanning electron microscopy
• Possibility of obtaining narrow particle sizes with a tolerance of ±1–2 µm
• Packaging in sealed bags with tamper-evident indicators
• Packaging in an inert atmosphere (upon request)
• Labeling with a batch number for full traceability
• Packaging in an inert atmosphere (upon request)
• Labeling with a batch number for full traceability
Catalog
Catalog
Ultra-fine copper powder 5 - 10 microns
Ultra-fine copper powder
5 - 10 microns
5 - 10 microns
Ultrafine copper powder, 99.9999% pure.
Obtained by vacuum evaporation and condensation of copper vapor.
Particle size: 5-10 µm.
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: spherical.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET jars;
0.25 kg glass ampoules;
85 kg containers.
Obtained by vacuum evaporation and condensation of copper vapor.
Particle size: 5-10 µm.
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: spherical.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET jars;
0.25 kg glass ampoules;
85 kg containers.
Ultrafine copper powder, 99.9999% pure.
Obtained by vacuum evaporation
and condensation of copper vapor.
Particle size: 5-10 µm.
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: spherical.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET jars;
0.25 kg glass ampoules;
85 kg containers.
Obtained by vacuum evaporation
and condensation of copper vapor.
Particle size: 5-10 µm.
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: spherical.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET jars;
0.25 kg glass ampoules;
85 kg containers.
Ultra-fine copper powder 15 - 30 microns
Ultra-fine copper powder
15 - 30 microns
15 - 30 microns
Ultrafine copper powder, 99.9999% pure.
Obtained by evaporation and condensation of copper vapor in an inert gas environment.
Particle size: 15-30 µm.
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: oval.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET cans;
in 85 kg containers.
Obtained by evaporation and condensation of copper vapor in an inert gas environment.
Particle size: 15-30 µm.
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: oval.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET cans;
in 85 kg containers.
Ultrafine copper powder, 99.9999% pure.
Obtained by evaporation and condensation of copper vapor in an inert gas environment.
Particle size: 15-30 µm.
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: oval.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET cans;
in 85 kg containers.
Obtained by evaporation and condensation of copper vapor in an inert gas environment.
Particle size: 15-30 µm.
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: oval.
Packaging: Powder stabilized in an argon environment.
Supplied in 2 kg PET cans;
in 85 kg containers.
Ultra-fine copper powder 30 - 50 microns
Ultra-fine copper powder
30 - 50 microns
30 - 50 microns
Finely dispersed copper powder with an octane rating of 99.9999%
Obtained by electrolytic precipitation from salt solutions using sieves
Particle size: 30-50 µm
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: oval and dendritic
Packaging: Powder stabilized in an argon environment,
supplied in 2 kg PET cans;
in 85 kg containers
Obtained by electrolytic precipitation from salt solutions using sieves
Particle size: 30-50 µm
Isotopic composition: Cu63-69.09%; Cu65-30.91%
Particle shape: oval and dendritic
Packaging: Powder stabilized in an argon environment,
supplied in 2 kg PET cans;
in 85 kg containers
Finely dispersed copper powder with an octane rating of 99.9999%
Obtained by electrolytic precipitation from salt solutions using sieves
Particle size: 30-50 µm
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: oval and dendritic
Packaging: Powder stabilized in an argon environment,
supplied in 2 kg PET cans;
in 85 kg containers
Obtained by electrolytic precipitation from salt solutions using sieves
Particle size: 30-50 µm
Isotopic composition: Cu63-69.09%;
Cu65-30.91%
Particle shape: oval and dendritic
Packaging: Powder stabilized in an argon environment,
supplied in 2 kg PET cans;
in 85 kg containers
Sampling from each batch submitted by the customer for certification is performed by a representative of the certification laboratory and is strictly accountable. All containers are labeled and sealed.
Analysis methods: Spark-gap mass spectrometry on a JMS-01-BM2 mass spectrometer using the "Mass Spectral Determination of Impurities (MSOP) B 1.1" method.
Analysis methods: Spark-gap mass spectrometry on a JMS-01-BM2 mass spectrometer using the "Mass Spectral Determination of Impurities (MSOP) B 1.1" method.
High specific surface area
→ Improved sinterability at low temperatures
→ Increased reactivity in chemical processes
→ Improved conductivity in composite materials
→ Increased reactivity in chemical processes
→ Improved conductivity in composite materials
Stable particle size distribution
→ Predictability of technological processes
→ Reduction of defects in additive manufacturing
→ Reproducibility of results in NIOKR
→ Reduction of defects in additive manufacturing
→ Reproducibility of results in NIOKR
Low content of impurities and oxides
→ Improving final product purity
→ Improving electrical properties
→ Meeting high-tech industry requirements
→ Improving electrical properties
→ Meeting high-tech industry requirements
Flexibility to suit the task
• Selecting a fraction for a specific process (3D printing, spraying, pastes, metallurgy)
• Possibility of modifying the surface for the binder
• Custom specifications based on customer requirements
• Possibility of modifying the surface for the binder
• Custom specifications based on customer requirements
Sampling from each batch submitted by the customer for certification is performed by a representative of the certification laboratory and is strictly accountable. All containers are labeled and sealed.
Analysis methods: Spark-gap mass spectrometry on a JMS-01-BM2 mass spectrometer using the "Mass Spectral Determination of Impurities (MSOP) B 1.1" method.
Analysis methods: Spark-gap mass spectrometry on a JMS-01-BM2 mass spectrometer using the "Mass Spectral Determination of Impurities (MSOP) B 1.1" method.
High specific surface area
→ Improved sinterability at low temperatures
→ Increased reactivity in chemical processes
→ Improved conductivity in composite materials
→ Increased reactivity in chemical processes
→ Improved conductivity in composite materials
Stable particle size distribution
→ Predictability of technological processes
→ Reduction of defects in additive manufacturing
→ Reproducibility of results in NIOKR
→ Reduction of defects in additive manufacturing
→ Reproducibility of results in NIOKR
Low content of impurities and oxides
→ Improving final product purity
→ Improving electrical properties
→ Meeting high-tech industry requirements
→ Improving electrical properties
→ Meeting high-tech industry requirements
Flexibility to suit the task
• Selecting a fraction for a specific process (3D printing, spraying, pastes, metallurgy)
• Possibility of modifying the surface for the binder
• Custom specifications based on customer requirements
• Possibility of modifying the surface for the binder
• Custom specifications based on customer requirements
Solutions for your industries
Additive manufacturing and 3D printing
Applications:
• Printing conductive electronic components
• Manufacturing heat exchangers with complex geometries
• Manufacturing electrodes for batteries and supercapacitors
Why choose PMU VPR:
✓ High sinterability → dense parts with minimal porosity
✓ Stable flowability → uniform deposition in a 3D printer
✓ Low oxide content → increased electrical conductivity of finished parts
• Printing conductive electronic components
• Manufacturing heat exchangers with complex geometries
• Manufacturing electrodes for batteries and supercapacitors
Why choose PMU VPR:
✓ High sinterability → dense parts with minimal porosity
✓ Stable flowability → uniform deposition in a 3D printer
✓ Low oxide content → increased electrical conductivity of finished parts
Powder metallurgy and composites
Applications:
• Production of copper and copper-graphite composites
• Manufacturing of plain bearings, filters, and porous structures
• Alloying and modification of alloys
Why PMU VPR:
✓ Controlled particle morphology → optimal packing and sinterability
✓ Low gas content → no defects in sintered products
✓ Batch stability → reproducible properties in serial production
• Production of copper and copper-graphite composites
• Manufacturing of plain bearings, filters, and porous structures
• Alloying and modification of alloys
Why PMU VPR:
✓ Controlled particle morphology → optimal packing and sinterability
✓ Low gas content → no defects in sintered products
✓ Batch stability → reproducible properties in serial production
Electronics and microelectronics
Applications:
• Conductive pastes and inks for circuit printing
• Contact materials and coatings
• Composites for shielding and heat dissipation
Why choose PMU VPR:
✓ Purity up to 6N → stable electrical characteristics
✓ Narrow particle size distribution → predictable paste rheology
✓ Export certification → availability for international supply chains
• Conductive pastes and inks for circuit printing
• Contact materials and coatings
• Composites for shielding and heat dissipation
Why choose PMU VPR:
✓ Purity up to 6N → stable electrical characteristics
✓ Narrow particle size distribution → predictable paste rheology
✓ Export certification → availability for international supply chains
Chemical industry and catalysis
Applications:
• Catalysts and catalyst supports
• Reagents for organic and inorganic synthesis
• Sorbents and functional fillers
Why PMU VPR:
✓ High specific surface area → increased catalytic activity
✓ Purity of composition → no side reactions
✓ Possibility of surface modification → customization for a specific process
• Catalysts and catalyst supports
• Reagents for organic and inorganic synthesis
• Sorbents and functional fillers
Why PMU VPR:
✓ High specific surface area → increased catalytic activity
✓ Purity of composition → no side reactions
✓ Possibility of surface modification → customization for a specific process
Scientific research and NIOKR
Applications:
• Reference materials for equipment calibration
• Research in nanotechnology and functional materials
• Development of new composites and coatings
Why PMU VPR:
✓ Reproducibility of characteristics → Reliability of experimental data
✓ Possibility of custom specifications → tailored to research objectives
✓ Full documentation support → compliance with grant and publication requirements
• Reference materials for equipment calibration
• Research in nanotechnology and functional materials
• Development of new composites and coatings
Why PMU VPR:
✓ Reproducibility of characteristics → Reliability of experimental data
✓ Possibility of custom specifications → tailored to research objectives
✓ Full documentation support → compliance with grant and publication requirements
2021-2026 ООО "Your Right Decision" High-Purity Metals from the Manufacturer
2021-2026 ООО "Your Right Decision" High-Purity Metals from the Manufacturer
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